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Keywords: Assembly Process Engineer, Location: Singapore

Page: 5

Equipment Engineer II

Equipment Engineer II As one of the world´s leading manufacturers of cardio- and endovascular medical devices... and changes the lives of patients every day. The Equipment Engineer II is responsible, as member of the interdisciplinary...

Company: Biotronik
Location: Singapore
Posted Date: 03 Apr 2025

Senior Equipment Engineer (Software Developer)

Senior Equipment Engineer (Software Developer) As one of the world´s leading manufacturers of cardio... world of cardiology and changes the lives of patients every day. The Senior Software Engineer, as member of the...

Company: Biotronik
Location: Singapore
Posted Date: 03 Apr 2025

Production Engineer II

and changes the lives of patients every day. The Production Engineer, as Process Owners (Production Process) are responsible... of Poka Yoke, SMED into assembly tooling and fixtures. Utilize 5S, 7-Mudas, Kaizen, Process flow, Spaghetti diagrams...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Production Engineer II (PIE)

environment in the capacity of Industrial Engineer on manual / automated assembly processes. Fresh graduate...Production Engineer II (PIE) As one of the world´s leading manufacturers of cardio- and endovascular medical devices...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Production Engineer II (PIE)

environment in the capacity of Industrial Engineer on manual / automated assembly processes. Fresh graduate...Production Engineer II (PIE) As one of the world´s leading manufacturers of cardio- and endovascular medical devices...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Senior Equipment Engineer (Software Developer)

Senior Equipment Engineer (Software Developer) As one of the world´s leading manufacturers of cardio... world of cardiology and changes the lives of patients every day. The Senior Software Engineer, as member of the...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Senior Advanced Manufacturing Engineer (Injection Moulding)

), Single Minute Exchange of Die (SMED) into assembly tooling and fixtures. Utilize 5S, 7-Mudas, Kaizen, Process flow...Senior Advanced Manufacturing Engineer (Injection Moulding) As one of the world´s leading manufacturers of cardio...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Production Engineer II

and changes the lives of patients every day. The Production Engineer, as Process Owners (Production Process) are responsible... of Poka Yoke, SMED into assembly tooling and fixtures. Utilize 5S, 7-Mudas, Kaizen, Process flow, Spaghetti diagrams...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Senior Advanced Manufacturing Engineer (Injection Moulding)

), Single Minute Exchange of Die (SMED) into assembly tooling and fixtures. Utilize 5S, 7-Mudas, Kaizen, Process flow...Senior Advanced Manufacturing Engineer (Injection Moulding) As one of the world´s leading manufacturers of cardio...

Company: Biotronik
Location: Singapore
Posted Date: 02 Apr 2025

Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 02 Apr 2025

Snr Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 02 Apr 2025

Snr Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 02 Apr 2025

Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 02 Apr 2025

Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 02 Apr 2025

Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 01 Apr 2025

Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 01 Apr 2025

Principal Engineer - HIG HBM - PE Design Validation

. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing... chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via...

Company: Micron
Location: Singapore
Posted Date: 01 Apr 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team...! Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... include: Process Development: Establish and improve PWF process conditions and technologies (wafer thinning, backside metal...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

technology for post-fab wafer finish and assembly processes Strong understanding of process flows, process interactions.... We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025