. Responsibilities Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development... Bonding/Grind/Trim process development will include performing fundamental research, consumables development, and hardware...
very innovation we are pursuing. Responsibilities Process module ownership involving Bonding/Grind/Trim process... goal for 3D NAND parts. Advanced 3D NAND Bonding/Grind/Trim process development will include performing fundamental...
. Process Optimization: Collaborate with PDE (Process Dev Team) to realize process benefits of equipment/CIP hardware Conduct... with Process development peers on deciding equipment technology choices for advanced nodes and translate future technology needs...