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Keywords: IC Package Design Engineer, Location: Pulau Pinang

Page: 1

IC Package Design Engineer

Position Overview As a IC Package Design Engineer, you will be responsible for executing high density package layout... package layout design including - Routing feasibility studies - Signal breakout & full path routing, including Length matching...

Company: UST Malaysia
Location: Pulau Pinang
Posted Date: 15 Feb 2026

Staff Signal Integrity Design Engineer

As Signal Integrity Design Engineer, you will be responsible for SI specification definition, modeling, analysis... of current and future AMD server products. You will work closely with multiple teams across IC Design, Layout, Packaging, Board...

Posted Date: 19 Feb 2026

Staff Signal Integrity Design Engineer

As Signal Integrity Design Engineer, you will be responsible for SI specification definition, modeling, analysis... of current and future AMD server products. You will work closely with multiple teams across IC Design, Layout, Packaging, Board...

Location: Pulau Pinang
Posted Date: 06 Feb 2026

SEPT 2026 intake - FRESH GRAD Only] Engineer, Packaging Engineering

: Responsible for influencing package and product design by addressing structural integrity and reliability issues and advancing the... for best engineering practice, of mechanical responses of IC package and flash products including solid state drives and process...

Company: SanDisk
Posted Date: 09 Mar 2026

Graduate Trainee - Product Development Engineer (Signal Integrity)

your career. THE ROLE: As Signal Integrity Design Engineer, you will be responsible for SI specification definition, modeling... Design, Layout, Packaging, Board, Product Engineer, Test Development, Application, Technical Service and Software to address...

Posted Date: 07 Mar 2026

Senior Lead Software Engineer - Linux Kernel

IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Summary The Senior Lead Engineer, Software develops...General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE...

Company: Celestica
Location: Pulau Pinang
Posted Date: 19 Feb 2026

Senior Lead Engineer, Software 1

IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Summary The Senior Lead Engineer, Software develops...General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE...

Company: Celestica
Location: Pulau Pinang
Posted Date: 19 Feb 2026

Senior Lead Engineer, Software 1

Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE IC/MGR...: Individual Contributor Direct/Indirect Indicator: Indirect Summary The Senior Lead Engineer, Software develops, debugs, tests...

Company: Celestica
Location: Pulau Pinang
Posted Date: 12 Feb 2026

Senior Lead Engineer, Software 1

​09 - Senior Lead Engineer, Software 1 Req ID: 127797 Remote Position: No Region: Asia Country: Malaysia State.../Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software...

Company: Celestica
Location: Pulau Pinang
Posted Date: 18 Dec 2025

Staff Signal Integrity/Power Integrity Engineer

of PCB development. Worked with architecture team, package design team and PCB design team for future PCB technology. Update... to completion. Strong/effective communication skills. Enthusiastic team-first mentality. Experience with PCB, Package and IC level...

Posted Date: 19 Feb 2026

Hardware Development Engineer

or equivalent, with 3-5 years of industry experience in IC Design, IC Test, or IC Test Hardware development or equivalent field... hardware development for IC testing - wafer or package level. Experience in Schematic review, PCB layout review...

Company: Altera
Location: Pulau Pinang
Posted Date: 17 Feb 2026

Staff Signal Integrity/Power Integrity Engineer

of PCB development. Worked with architecture team, package design team and PCB design team for future PCB technology. Update... to completion. Strong/effective communication skills. Enthusiastic team-first mentality. Experience with PCB, Package and IC level...

Posted Date: 08 Feb 2026

Senior Engineer, Packaging Engineering

. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product... groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability...

Company: SanDisk
Location: Pulau Pinang
Posted Date: 07 Feb 2026

Staff Signal Integrity/Power Integrity Engineer

of PCB development. Worked with architecture team, package design team and PCB design team for future PCB technology. Update... to completion. Strong/effective communication skills. Enthusiastic team-first mentality. Experience with PCB, Package and IC level...

Location: Pulau Pinang
Posted Date: 31 Jan 2026

Staff Signal Integrity/Power Integrity Engineer

mentality. Experience with PCB, Package and IC level power delivery networks. Experience in silicon packaging and PCB design... checklists for various stages of PCB development. Worked with architecture team, package design team and PCB design team...

Posted Date: 30 Jan 2026