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Keywords: Packaging Engineer, Location: Pulau Pinang

Page: 3

HSIO Validation Staff Engineer

As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves... enablement to improve process and throughput. Collaborate, review and influence design teams including hardware/packaging/board...

Posted Date: 24 Feb 2026

Staff Package Engineer

as the Staff Packaging Engineer, to manage and to drive improvement on assembly and NPI engineering at subcontractor factory...Description Staff Package Engineer Power Integrations is looking for experience talent with highly motivation...

Location: Pulau Pinang
Posted Date: 23 Feb 2026

Staff Signal Integrity Design Engineer

As Signal Integrity Design Engineer, you will be responsible for SI specification definition, modeling, analysis... of current and future AMD server products. You will work closely with multiple teams across IC Design, Layout, Packaging, Board...

Posted Date: 19 Feb 2026

Physical Design Engineer (RTL2GDSII)

Jobs Job Description Apply now Start Please wait... Job Title: Physical Design Engineer (RTL2GDSII) City: Penang State/Province: Penang Posting... for a client ͏ Physical Design Engineer (RTL2GDSII) Looking for PD engineers with 3+ years experience to independently own...

Company: Wipro
Location: Pulau Pinang
Posted Date: 16 Feb 2026

Sept 2026 intake - Fresh Grad Only] Engineer, Supplier Quality Engineering

. Job Description We are seeking a detail-oriented and analytical Supplier Quality Engineer to join our team in Penang, Malaysia. In this role... for components or product engineer where gets to learn manufacturing processes, reliability and quality requirement for components...

Company: SanDisk
Posted Date: 11 Feb 2026

Package Reliability Engineer/Senior Package Reliability Engineer

to learn, communicate and advance faster than ever. As a GQ (Global Quality) Package Reliability Engineer at Micron Technology... Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron...

Company: Micron
Location: Pulau Pinang
Posted Date: 08 Feb 2026

Physical Design Engineer

Physical Design Engineer - Semiconductor | Penang (Mandarin Speaking) We are looking for a Physical Design (Backend...) Engineer to join our semiconductor engineering team in Penang, Malaysia. This role will work across the end-to-end chip...

Company: LanceSoft, Inc.
Location: Pulau Pinang
Posted Date: 07 Feb 2026

Staff Signal Integrity Design Engineer

As Signal Integrity Design Engineer, you will be responsible for SI specification definition, modeling, analysis... of current and future AMD server products. You will work closely with multiple teams across IC Design, Layout, Packaging, Board...

Location: Pulau Pinang
Posted Date: 06 Feb 2026

Smart Connected Product R&D SW Engineer

with various measurement instruments, working closely with instrument product R&D engineer for standardize implementation.... Configure and improve automated builds (CI/CD), Jenkins build pipelines, nuget packaging and code signing using certificates...

Location: Pulau Pinang
Posted Date: 06 Feb 2026

Fellow FPGA Design Engineer

As a fellow design engineer in our FPD team, you will be responsible for leading and optimizing the Fabric PPAC in the Adaptive... solutions in the fabric Preferred Experience Programmable logic fundamentals Next generation process and packaging technologies...

Location: Pulau Pinang
Posted Date: 27 Jan 2026

Fellow FPGA Design Engineer

your career. THE ROLE: As a fellow design engineer in our FPD team, you will be responsible for leading and optimizing the... fundamentals Next generation process and packaging technologies Binning and circuit margins, including VID, Aging Regulators...

Posted Date: 11 Jan 2026

Senior Staff Hardware Development Engineer (Package Design)

design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost..., manufacturing time etc) for various device packaging. Collaborate with PCB Layout Engineers to optimize the package ballmap...

Posted Date: 26 Dec 2025

Graduate Talent (Software EDA Design Automation Engineer)

drive breakthrough research, develop next generation process and packaging technologies, while also running high volume... manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging...

Company: Intel
Location: Pulau Pinang
Posted Date: 11 Mar 2026

Process and Equipment Engineer (Contract)

while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the... improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive...

Company: Intel
Location: Pulau Pinang
Posted Date: 11 Mar 2026

Process and Equipment Engineer

-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging...

Company: Intel
Location: Pulau Pinang
Posted Date: 11 Mar 2026

Graduate Talent (Test Chip Physical Design Engineer)

drive breakthrough research, develop next generation process and packaging technologies, while also running high volume... manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging...

Company: Intel
Location: Pulau Pinang
Posted Date: 11 Mar 2026

Process Engineer (PCB)

Our client is a global top tier manufacturer of memory module Printed Circuit Boards (PCB) and Semiconductor Packaging...

Company: JAC Recruitment
Location: Pulau Pinang
Posted Date: 10 Mar 2026
Salary: 48000 - 84000 per year

SR R&D/PRODUCT DVL ENGINEER

and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing...

Company: TE Connectivity
Location: Pulau Pinang
Posted Date: 08 Mar 2026

Mechanical Engineer (Teradyne, Penang)

working with E/M packaging layout and design including sheet metal, plastics, cabling, and PC Boards Demonstrated proficiency...

Company: Teradyne
Posted Date: 07 Mar 2026

Physical Design Engineer

manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure...

Company: Intel
Location: Pulau Pinang
Posted Date: 06 Mar 2026