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Keywords: Packaging Engineer, Location: Shanghai

Page: 2

Customer Engagement Applications Engineer

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Shanghai
Posted Date: 16 Jan 2026

Software Engineer

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Shanghai
Posted Date: 10 Jan 2026

Product Install Engineer

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Shanghai
Posted Date: 09 Jan 2026

Aftertreatment System Design Engineer

fields, covering core links such as catalyst, carrier, packaging structure, urea injection system, control strategy...

Company: Johnson Matthey
Location: Shanghai
Posted Date: 19 Dec 2025

Senior Semiconductor & ASIC Sourcing Engineer_PS

technical discussions with suppliers on Semiconductor technologies, Packaging concepts, and Product roadmaps and second-source... manufacturing processes, including: Wafer technologies and process nodes Assembly and packaging concepts Understanding of ASIC...

Company: Bosch
Location: Shanghai
Posted Date: 05 Feb 2026

Senior Semiconductor & ASIC Sourcing Engineer_PS

technical discussions with suppliers on Semiconductor technologies, Packaging concepts, and Product roadmaps and second-source... manufacturing processes, including: Wafer technologies and process nodes Assembly and packaging concepts Understanding of ASIC...

Company: Bosch
Location: Shanghai
Posted Date: 05 Feb 2026

Manager, Engineering

plans to close engineer skill gaps crucial for digital transformation. - Champions continuous learning, technology... management systems (ISO’s). Familiarity with Maximo CMMS, knowledge in packaging material and cold drink equipment. Excellent...

Company: Coca-Cola
Location: Shanghai
Posted Date: 01 Feb 2026