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Keywords: Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA), Location: Singapore

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Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes... bonding, plating, warpage control and packaging field Strong understanding of process flows, process interactions...

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Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/ Senior/ Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes... bonding, plating, warpage control and packaging field Strong understanding of process flows, process interactions...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

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