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Keywords: Silicon Photonic Packaging , Location: USA

Page: 3

Principal Asic Engineer

that fit in the palm of your hand. Leveraging cutting-edge silicon photonic chips, our sensors deliver unparalleled accuracy... Photonics is seeking an exceptional Principal Mixed-Signal ASIC Engineer to architect and build the custom silicon that forms...

Company: Voyant Photonics
Location: New York City, NY
Posted Date: 09 Jan 2026

Principal Asic Engineer

that fit in the palm of your hand. Leveraging cutting-edge silicon photonic chips, our sensors deliver unparalleled accuracy... Photonics is seeking an exceptional Principal Mixed-Signal ASIC Engineer to architect and build the custom silicon that forms...

Company: Voyant
Location: New York City, NY
Posted Date: 08 Jan 2026

Postdoctoral Appointee - Quantum Communication

volume silicon nanophotonic cavities and to directly route single photons to/from the memory via optical fibers. The..., materials science, or a related field Experience in photonic and/or superconducting device nanofabrication Experience working...

Posted Date: 21 Dec 2025
Salary: $72879 - 121465 per year

Principal Reliability Engineer

optoelectronic and silicon photonic components in a highly complex, dynamic R&D setting. This senior level position is expected... Experience with subassembly and semiconductor packaging processes and controls Skills Semiconductor device reliability...

Company: II-VI
Location: Fremont, CA
Posted Date: 17 Dec 2025

Lead Analog SerDes Architect/Design Engineer

connectivity for data centers through cutting-edge silicon photonics integration. As part of Intel’s Data Center Group... the world’s first hybrid silicon laser, IPS has led the industry in scalable, high-volume manufacturing and advanced...

Company: Intel
Location: Santa Clara, CA
Posted Date: 03 Dec 2025

Assistant/Associate/Full Professor - College of Engineering - Mechanical and Industrial Engineering - Oakland

collaboration with semiconductor industry partners in Silicon Valley, with academic partners at UC Berkeley, UC San Francisco... integration for CMOS, beyond-CMOS, and heterogeneous systems - 3D heterogeneous integration and advanced packaging...

Posted Date: 22 Nov 2025
Salary: $103000 - 121000 per year