Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group Packaging Engineering General... world leaps forward. In this highly visible role, you will be responsible for developing advanced 2.5D packaging...
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group Packaging Engineering General..., and fan. Industry exposure to 2.5/3D packaging is highly desirable. Ability to write scripts in programming languages...
Company: Qualcomm Technologies, Inc.Job Area: Engineering Group, Engineering Group Packaging EngineeringGeneral... Summary: Qualcomm's Hardware Systems organization is seeking a seasoned Thermal Engineer to join our team. The qualified...
, epoxies and curing, and packaging (sterile barrier, secondary, tertiary boxing) You have an advanced communication skillset...
/Fedora, Ubuntu/Debian) and build frameworks, including packaging, update mechanisms, upstream integration, and data center... systems for open-source or large-scale projects. Familiarity with Linux packaging systems (Debian, RPM) and CI/CD automation...
. Job Mission The mission of the Mechanical Design Engineer at ASML is to create incredible products using the latest technology... handling for thermal management of equipment and enclosures, large enclosure design, electrical component packaging, mechanical...