Packaging IC EDA tools and design methods including: 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer... performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving...
tools and methodologies? Join our dynamic team as a Hardware Design Tools and Methodology Engineer, where you'll play..., collaborating with industry leaders to shape the next generation of design automation solutions. Why Join Us? This is your chance...
have... Master's degree in Electrical Engineering with a focus on power electronics, mixed-signal IC design, or semiconductor.... Semiconductor & IC Expertise: Strong understanding of SoC and SiP trends, including 2.5D/3D packaging and their impact on thermal...
an intelligent and versatile RF designer to join the RFIC and IC/package co-design team, enabling state-of-the-art performance... both written and verbal Experience with RF EDA tools such as: Cadence Allegro, Cadence Clarity, Ansys 3D Layout, Ansys HFSS, ADS...
to join the RFIC and IC/package co-design team, enabling state-of-the-art performance for the world’s highest performing RF data... Experience with RF EDA tools such as: Cadence Allegro, Cadence Clarity, Ansys 3D Layout, Ansys HFSS, ADS RFPro and Momentum...
into mixed-signal silicon. System-in-Package (SiP) Integration: Drive the transition from discrete components to SiP solutions... executive summaries to management. Design Flows: Experience with EDA tools (Cadence, Mentor Graphics, Synopsys), FPGA...