communication Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred...Job Description: Summary: To support R&D activities for 2.5D wafer-level packaging (WLP) processesincluding...
communication Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred...Job Description: Purpose of the Job: To support R&D activities for 2.5D wafer-level packaging (WLP...
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... interaction issues on an advanced scanning electron microscopy instrument. Acting independently, devise and drive innovative...
of our Unit Module Development Team, leading exciting projects in Advanced Packaging, Photonics & Power platforms.... Job description: To set up processes as per technical requirements and lead Litho module UMD process engineers develop advanced packaging...