packages. Job : Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving..., Chemical, Mechanical, or related field) 3+ years of hands-on experience in semiconductor packaging process development...
of WoW or CoW bonding is a bonus. Opportunities On-job training on CoW hybrid bonding processes and challenges.../TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development...
such as 2.5D/EFB/CoWoS/WLFO, CPO, CoW/WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies. Lead Data Collection..., device analysis, test, technology integration, and product development, and build collaborative relationships with external...
semiconductor packages. Key Job Accountabilities: Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation... development (Die Prep, Chip Attach, or Mold) Proficient in DOE, FMEA, statistical process control, and failure analysis Familiar...