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Keywords: Chiplet and 3D Stacking Engineer, Senior Staff, Location: Hsinchu City

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Chiplet and 3D Stacking Engineer, Senior Staff

of chiplet physical design methodology and PDK development 3D DRAM and Cache SRAM Architecture evaluation... responsiveness. This is the Invention Age - and this is where you come in. Keywords: 3DIC, STCO, PPAC, Physical design, Chiplet...

Company: Qualcomm
Location: Hsinchu City
Posted Date: 20 Dec 2025

AI Compute and Chiplet Systems Engineer, Senior Staff

a highly skilled engineer to develop 2.5D/ 3D chiplet and networking solution based technology-systems co-optimized..., 2.5D/ 3D chiplet architecture, networking technologies and trade-offs. Knowledge of different IPs e.g. CPU, GPU, NPU...

Company: Qualcomm
Location: Hsinchu City
Posted Date: 20 Dec 2025