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Keywords: Die Attach TD Module Engineer, Location: Kulim, Kedah

Page: 1

Die Attach TD Module Engineer

Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD...Job Details: Job Description: The position is for Package Module Development Engineer for Thermal Compression...

Company: Intel
Location: Kulim, Kedah
Posted Date: 08 Jan 2026