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Keywords: Direct Lid/Stiffener Attach Packaging Module Development Engineer, Location: Kulim, Kedah

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Direct Lid/Stiffener Attach Packaging Module Development Engineer

). Involvement in research and development in assembly and packaging. Knowledge in statistical design of experiments and problem...'s roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing...

Company: Intel
Location: Kulim, Kedah
Posted Date: 25 Feb 2026