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Keywords: Engineer, Advanced Packaging Process and Equipment Technology Development Engineering, Location: Singapore

Page: 1

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

, reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer... in semiconductor process or equipment engineering experience would be beneficial Understand in equipment development with fundamental...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Engineer, Shift Lead, Advanced Packaging Technology Development

decisions and recommendations to help facilitate equipment and process related improvement activities Provides troubleshooting... support for complex problems and address root causes Provides effective and timely guidance to resolve equipment/process...

Company: Micron
Location: Singapore
Posted Date: 03 Jul 2025

MTS Advanced Packaging Lithography Process Engineering

of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global... is seeking highly skilled and motivated Experienced Lithography Process Engineer to become part of our starting 300mm Advance...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

MTS Advanced Packaging Etch Process Engineering

is seeking highly skilled and motivated Experienced Process Engineer to become part of our starting 300mm Advance Packaging... to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Dry Etch

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development..., reliability and schedule requirements. Process Development: Establish and improve PWF process conditions and technologies (wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025