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Keywords: Engineer, Process Integration PDE (Package Development Engineering), Location: Singapore

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Engineer, Process Integration PDE (Package Development Engineering)

, and readiness activities Assist with NPI-to-High Volume Manufacturing (HVM) handoff activities and documentation Process Integration... or related discipline 0-2 years of relevant experience in semiconductor manufacturing, process, or product engineering Basic...

Company: Micron
Location: Singapore
Posted Date: 12 Mar 2026

Staff Engineer, Package Development & Engineering

, Materials Science, or related technical discipline. 8+ years of experience in semiconductor packaging, process integration...Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure. Define...

Company: Micron
Location: Singapore
Posted Date: 17 Jan 2026

Staff Engineer, Package Development & Engineering

, or related technical field. 8+ years of experience in semiconductor packaging, process integration, or technology development...Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure. Define project missions...

Company: Micron
Location: Singapore
Posted Date: 17 Jan 2026

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM... team collaboration. Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD...

Company: Micron
Location: Singapore
Posted Date: 11 Mar 2026

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM... team collaboration. Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD...

Company: Micron
Location: Singapore
Posted Date: 11 Mar 2026