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Keywords: Engineer Unit Process Engineering Die Bond, Location: Melaka

Page: 1

Engineer Unit Process Engineering Die Bond

in Mechanical, Manufacturing, Electronics or related Engineering. More than 2 years related experience in FOL Process Engineering... or in Semiconductor Assembly Manufacturing background. Die Bond Process. Process & product control. Productivity/process improvement...

Company: Infineon
Location: Melaka
Posted Date: 16 Jan 2026

Senior Staff Engineer Unit Process Engineering

, DMAIC, Process Mapping, FTA, Fish Bond. Good knowledge and skills in production area; Good leadership skills able...Responsible to develop a robust process and continuously drive improvement in yield and quality to meet KPI. Your Role...

Location: Melaka
Posted Date: 17 Dec 2025

Senior Staff Engineer Unit Process Engineering

. Systematic Problem Solving methodology e.g. 8D, DMAIC, Process Mapping, FTA, Fish Bond. Good knowledge and skills in production...Responsible to develop a robust process and continuously drive improvement in yield and quality to meet KPI...

Company: Infineon
Location: Melaka
Posted Date: 06 Dec 2025