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Keywords: IC Package/System Design Solution Engineer, Senior, Location: Hsinchu City

Page: 1

IC Package/System Design Solution Engineer, Senior

and understanding of hard macro block placement, padring, RDL and bump pattern/assignment. System level co-design methodology of IC... and electrical performance with the goal to achieve lowest system level cost. Package design flow methodology implementing high...

Company: Qualcomm
Location: Hsinchu City
Posted Date: 01 Feb 2026