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Keywords: Microelectronics Packaging Intern (Summer 2026)(Onsite), Location: Cedar Rapids, IA

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Microelectronics Packaging Intern (Summer 2026)(Onsite)

today while anticipating their needs for tomorrow. The Microelectronics Packaging group within ART is seeking to fill a Mechanical... Engineering internship position. This group is responsible for the Microelectronics Packaging technology activities throughout...

Posted Date: 18 Feb 2026
Salary: $37000 - 82000 per year