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Keywords: Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering, Location: Singapore

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Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

, reliability and schedule requirements. Process Development: Establish and improve Wafer level process conditions and technologies... process management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025