_ THE ROLE: The job role will be responsible for advanced 2.5D & 3D IC packaging technology evaluation, design enablement... advanced packaging technology and drive system-technology co-optimization (STCO) of FPGA and ASIC products at advanced nodes...
Product Engineer, you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing..., with focus on Advanced IC Package Routing, Technologies, and Flows. Location; San Jose, CA, on-site. As an IC Packaging...
_ THE ROLE: The job role will be responsible for advanced silicon technology evaluation, design enablement, product..., device physics, reliability mechanisms as well as foundry PDK support. Knowledge of 3DIC and advanced packaging technologies...