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Keywords: Principal Design Engineer, TSV Packaging, Location: Boise, ID

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Principal Design Engineer, TSV Packaging

Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM... with global teams in product design, engineering, technology, and business units to analyze manufacturing processes using...

Company: Micron
Location: Boise, ID
Posted Date: 12 Dec 2025

Principal Thermal Simulation Engineer, APTD

customers to fully understand the product thermal risks and help optimize the packaging design by simulation support. Work...Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM...

Company: Micron
Location: Boise, ID
Posted Date: 12 Dec 2025