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Keywords: Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding), Location: Kulim, Kedah

Page: 1

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve... and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment...

Location: Kulim, Kedah
Posted Date: 15 Jan 2026

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order... execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the...

Company: Intel
Location: Kulim, Kedah
Posted Date: 13 Jan 2026