Job Description: Job Title: R&D Process Engineer (MOLD) Summary: Process development and characterization for R.... Job Develop wafer level Molding and debond process capabilities to achieve a good quality and wafer warpage for advanced packaging...
development (Die Prep, Chip Attach, or Mold) Proficient in DOE, FMEA, statistical process control, and failure analysis Familiar...Job Description: Purpose of the Job: To support R&D activities for 2.5D wafer-level packaging (WLP...
. Bring your fresh perspective, develop your strengths, break out your mold, and find a career that fits your dreams... projects within Advanced Process Innovation program (i.e., primarily within process efficiency workstream) by developing...