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Keywords: Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet), Location: Singapore

Page: 1

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

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Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

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