. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...
Requires a technical (University) degree. (Exceptions approved by local HR). Knowledge on wafer bonding, TOS, TOV, and hybrid..., advanced packaging, and niche products as added features. Encourage elegant solution through innovation and out-of-the-box...