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Keywords: Senior Process Engineer - Wafer-Bonder-Dicing-Grinding, Location: Central Region, Singapore

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Senior Process Engineer - Wafer-Bonder-Dicing-Grinding

-Bonding / Wafer-Dicing / Wafer-Grinding. 4. Experience in high volume production of electronics components in an MNC or semi... or Backend -assembly - Wafer -Bonding / -Dicing / -Grinding processes, equipment, and materials. 2. Strong organizational...

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Company: Qualcomm

Location: Central Region, Singapore

Posted Date: 03 Oct 2025

Senior Equipment Engineer - Wafer-Bonder-Dicing-Grinding

or equivalent. 2. Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance. 3. Hands...-on experience in troubleshooting of Wafer-Bonder or/and Wafer-Dicer/Grinder. 4. Experience in high volume production...

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Company: Qualcomm

Location: Central Region, Singapore

Posted Date: 03 Oct 2025

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