and Chiplet package Manufacturing readiness for New Product bring up at manufacturing site. Responsible for packaging yield... standardization and continuous improvement. Responsible for the packaging interaction activities among assembly, bumping, 3D IC, HBM...
at manufacturing site. Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining... activities. Drive assembly process baseline standardization and continuous improvement. Responsible for the packaging...
Person The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier... process development with a deep knowledge of packaging and board design rules, process flows and materials...
interface with suppliers of bump, assembly, and advance packaging service to AMD. Ensure that suppliers have developed...
product roadmap THE PERSON: The candidate should have a proven track record in developing advanced packaging technologies...-on approach to new process development with a deep knowledge of packaging and board design rules, process flows and materials...
The AMD Adaptive and Embedded Computing Group is seeking an experienced and self-motivated package design engineer... packaging. Collaborate with PCB Layout Engineers to optimize the package ballmap and chip team to optimize the die size Develop...
design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost..., manufacturing time etc) for various device packaging. Collaborate with PCB Layout Engineers to optimize the package ballmap...
packaging service to AMD. Ensure that suppliers have developed and executed manufacturing control plans to ensure compliance...
packaging service to AMD. Ensure that suppliers have developed and executed manufacturing control plans to ensure compliance...
Bachelor's or Master's degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology... and product lifecycle management. Strong understanding of semiconductor packaging manufacturing flows - including development...