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Keywords: Sr ASIC Packaging Engineer (Remote), Location: Boise, ID

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Sr ASIC Packaging Engineer – (Remote)

Sr ASIC Packaging Engineer – (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical... Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...

Apply Now
Company: Encore Semi
Location: Boise, ID
Posted Date: 08 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer - (Remote)

Sr ASIC Packaging Engineer - (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical... Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...

Apply Now
Company: Encore Semi
Location: Boise, ID
Posted Date: 08 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer (Remote)

Sr ASIC Packaging Engineer – (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical... Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...

Apply Now
Company: Encore Semi
Location: Boise, ID
Posted Date: 07 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer (Remote)

Sr ASIC Packaging Engineer - (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical... Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...

Apply Now
Company: Encore Semi
Location: Boise, ID
Posted Date: 06 Mar 2026
Salary: $135000 - 150000 per year

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