: We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging technology development and new...-volume manufacturing of advanced IC packages. Expertise in bumping, WLP, FOWLP, FOPLP, 2.5D RDL packaging materials...
as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies... substrate technologies used in advanced semiconductor packaging. The role requires IC substrate fine patterning, small via, new...
motivated, talented Senior Staff Product Engineer. You will part of a dynamic product engineering team working on most advanced...-electronic devices. Prior NPI/manufacturing experience in integrated advanced 2.5/3D package, MCM SMT package...
Summary: Qualcomm Process Packaging Solution (PPS) team is looking for talented, self-motivated candidates who... are experienced in Computer programming, Data analysis and advanced AI development. The candidate will collaborate with large...
: DRAM, Diagnostics, ML/AI We are seeking a highly skilled Diagnostics Analytics Engineer to advance data-driven yield... learning for advanced 2.5D and 3DIC products. The role involves interpreting a wide range of diagnostic data, including memory...
to have keywords: Yield, ATPG, AI General Summary: We are seeking an experienced engineer to lead the research, design..., and development of advanced diagnostics solutions for 2.5D and 3DIC products with a strong focus on DRAM and wafer stacking interfaces...
, and decision frameworks to support early-stage architecture and technology exploration for advanced SoCs and chiplet-based...-level trade-offs across architecture, technology, and packaging domains, with increasing relevance to AI-driven workloads...
and technology pathfinding for advanced SoCs and chiplet based platforms. The position drives early architecture, packaging... architectures. The engineer defines system KPIs beyond PPAC, evaluates architecture-technology-packaging trade-offs, and supports...