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Keywords: Staff IC Packaging Engineer, Location: Bangalore, Karnataka

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Staff IC Packaging Engineer

General Summary: We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC... development and high-volume manufacturing of advanced IC packages. Expertise in Flip Chip CSP, FCBGA and SiP packaging materials...

Company: Qualcomm
Posted Date: 08 Jan 2026

CPU Physical Design Engineer, Staff

Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical... systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch...

Company: Qualcomm
Posted Date: 17 Dec 2025