in advanced IC package development and high-volume manufacturing. Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials..., and direct engagement with semiconductor material suppliers. Understanding of industry packaging trends, end-user packaging...
packaging environment. - Experience with development, high-volume manufacturing, troubling shooting of IC substrate (FCBGA/FCCSP...) - Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard...
knowledge of key advanced packaging processes Hands-on experience on large module/die assembly challenges, chip on wafer/panel...