Find your dream job NOW!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering, Location: Singapore

Page: 1

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering

Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside... with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026

Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside... with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 22 Jan 2026

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... packaging and die stacking Chip on Wafer, Chip to Wafer. Focus on improving product quality, driving yield improvements...

Company: Micron
Location: Singapore
Posted Date: 06 Feb 2026

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global... Quality, to integrate manufacturing processes for optimal performance and quality control Bachelor's or advanced degree...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026

Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026