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Keywords: Engineer, APTD CEM - Advanced Packaging Equipment Engineering, Location: Singapore

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Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for product transfer to production High Volume Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering

Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical... projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment and materials...

Company: Micron
Location: Singapore
Posted Date: 07 Feb 2026

Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical... projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment and materials...

Company: Micron
Location: Singapore
Posted Date: 22 Jan 2026