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Keywords: Engineer, APTD CEM - Advanced Packaging Equipment Engineering, Location: Singapore

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Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 10 Oct 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for product transfer to production High Volume Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

equipment and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment... Evaluate, promote, and plan for new equipment and materials Ensure defense coverage through process, measurement, inspection...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical... projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment and materials...

Company: Micron
Location: Singapore
Posted Date: 24 Oct 2025

Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical... projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment and materials...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025