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Keywords: Packaging Module Development Engineer, Location: Phoenix, AZ

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Packaging Module Development Engineer

solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will. Contribute... is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge...

Company: Intel
Location: Phoenix, AZ
Posted Date: 26 Feb 2026
Salary: $133800 - 188890 per year

Packaging Module Equipment Development Engineer

Job Details: Job Description: The packaging module equipment development engineer develops assembly processes... systems, and methods and continuously engages with packaging technology development and partner engineering groups on process...

Company: Intel
Location: Phoenix, AZ
Posted Date: 26 Feb 2026

Packaging Module Process Development Engineer

packaging solutions for emerging workloads (AI, edge computing) Packaging Module Equipment Development Engineer..., manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering...

Company: Intel
Location: Phoenix, AZ
Posted Date: 14 Feb 2026

Senior Data Scientist (Quality Systems)

substrate roadmap a reality. We do this by collaborating with external suppliers to demonstrate disruptive packaging... network. The Quality Engineer's quest to elevate quality standards internally and at substrate suppliers is vital for the...

Company: Intel
Location: Phoenix, AZ
Posted Date: 22 Feb 2026
Salary: $140830 - 198820 per year