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Keywords: Packaging Module Equipment Development Engineer, Location: Phoenix, AZ

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Packaging Module Equipment Development Engineer

packaging solutions for emerging workloads (AI, edge computing) Packaging Module Equipment Development Engineer... with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk...

Company: Intel
Location: Phoenix, AZ
Posted Date: 12 Dec 2025

Shift 6 Module Engineer On Shift (MEOS)

role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues...). Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer...

Company: Intel
Location: Phoenix, AZ
Posted Date: 06 Dec 2025
Salary: $80310 - 156540 per year

Shift 5 Module Engineer On Shift (MEOS)

role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues...). Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer...

Company: Intel
Location: Phoenix, AZ
Posted Date: 06 Dec 2025
Salary: $80310 - 156540 per year

Shift 4 Module Engineer On Shift (MEOS)

role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues...). Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer...

Company: Intel
Location: Phoenix, AZ
Posted Date: 06 Dec 2025
Salary: $80310 - 156540 per year

SPTD Quality Engineer (PCS)

substrate roadmap a reality. We do this by collaborating with external suppliers to demonstrate disruptive packaging... network. The Quality Engineer's quest to elevate quality standards internally and at substrate suppliers is vital for the...

Company: Intel
Location: Phoenix, AZ
Posted Date: 11 Dec 2025
Salary: $136990 - 193390 per year