Find your dream job NOW!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering, Location: Singapore

Page: 1

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 10 Oct 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly.../Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025