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Keywords: Module Development Engineer, Location: Kulim, Kedah

Page: 1

Module Development Engineer

module process development. A successful candidate will own definition, development, and transfer of test processes into the... configuration for the module Collaboration with technology development partner organizations Supports early samples and production...

Location: Kulim, Kedah
Posted Date: 24 Dec 2025

Packaging Module Development Engineer

Job Details Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process... in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux...

Location: Kulim, Kedah
Posted Date: 17 Jan 2026

Packaging Module Development Engineer

Job Details: Job Description: - Process Development Engineer Role in Solder Ball Attach or Chip Attach Process... in Technology Development Organization - CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach...

Company: Intel
Location: Kulim, Kedah
Posted Date: 09 Jan 2026

Die Attach TD Module Engineer

Job Details: Job Description: The position is for Package Module Development Engineer for Thermal Compression... Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD...

Company: Intel
Location: Kulim, Kedah
Posted Date: 08 Jan 2026

Test Module Engineer

across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates..., productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned...

Company: Intel
Location: Kulim, Kedah
Posted Date: 16 Jan 2026

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment... with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the...

Location: Kulim, Kedah
Posted Date: 15 Jan 2026

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the..., defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high...

Company: Intel
Location: Kulim, Kedah
Posted Date: 13 Jan 2026

Process and Equipment Engineer

and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment... with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the...

Location: Kulim, Kedah
Posted Date: 21 Dec 2025

Process and Equipment Engineer

and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment... with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the...

Company: Intel
Location: Kulim, Kedah
Posted Date: 18 Dec 2025

Process and Equipment Engineer

across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components..., cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line...

Company: Intel
Location: Kulim, Kedah
Posted Date: 07 Dec 2025