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Keywords: Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering, Location: Singapore

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Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/ Senior/ Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes..., or other related technical fields 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025