. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...
. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...
. We are looking for an Advanced Packaging Equipment Engineer to join our Advanced Packaging Technology Development (APTD) team... and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus...
, advanced packaging, and niche products as added features. Encourage elegant solution through innovation and out-of-the-box... in and/or leads (project) teams Relationship Focus Limited and supervised contact at engineering level. Maintains awareness...