Find your dream job now!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering, Location: Singapore

Page: 1

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... partners to build and execute technology development strategies aligned with organizational and business objectives Work...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

, reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025