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Keywords: Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering, Location: Singapore

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Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus.... We are looking for an Advanced Packaging Equipment Engineer to join our Advanced Packaging Technology Development (APTD) team...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal Engineer (Product Line Process Integration)

, advanced packaging, and niche products as added features. Encourage elegant solution through innovation and out-of-the-box... in and/or leads (project) teams Relationship Focus Limited and supervised contact at engineering level. Maintains awareness...

Company: GlobalFoundries
Location: Singapore
Posted Date: 26 Mar 2025