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Keywords: Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering, Location: Singapore

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Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test..., preferably in wafer bonding, plating, warpage control and packaging field Strong understanding of process flows, process...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025