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Keywords: Senior/Engineer, Advanced Packaging Integration - Chip to Package Integration, Location: Singapore

Page: 1

Senior/Engineer, Advanced Packaging Integration - Chip to Package Integration

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/Mechanical Engineer (R&D)

-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Singapore
Posted Date: 21 Jun 2025

System Design Engineer (Mechanical / Opto-Mechanical / R&D)

-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Singapore
Posted Date: 31 May 2025