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Keywords: Senior/Engineer, Advanced Packaging Die Level Technology - Materials, Location: Singapore

Page: 1

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Dry Etch

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

, reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

, reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Mechanical Engineer (R&D)

engineers, application development engineers, and senior product technology process engineers. The Surfscan group includes... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Singapore
Posted Date: 20 Jun 2025