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Keywords: Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly, Location: Singapore

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Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus.... We are looking for an Advanced Packaging Equipment Engineer to join our Advanced Packaging Technology Development (APTD) team...

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Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Dry Etch

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bonding/Debonding

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

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