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Keywords: Engineer, Advanced Packaging Integration Engineering, Location: Singapore

Page: 2

Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes... with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Metrology

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes... with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Dry Etch

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test... Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

MTS Metrology and Inspection, ULP CMOS Advanced Packaging

ULP CMOS product team is looking to hire a metrology engineer to join our growing Advanced packaging team in our Singapore... technical know-how and creativity to ensure critical risks are covered in the advanced packaging, new features and new offerings...

Company: GlobalFoundries
Location: Singapore
Posted Date: 18 Jun 2025

MTS, ULP CMOS Advanced packaging Integrator

ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team... from an accredited university. Additional professional experience in advanced module development, integration and/or advanced packaging...

Company: GlobalFoundries
Location: Singapore
Posted Date: 13 Jun 2025

PMTS ULP CMOS Advanced Packaging Program Manager

ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team... development, integration and/or advanced packaging: B.S. + minimum of 15+ years of relevant experience M.S. + minimum of 10...

Company: GlobalFoundries
Location: Singapore
Posted Date: 13 Jun 2025

SMTS ULP CMOS Advanced Packaging D2W Integrator

integration engineer to join our growing Advanced packaging team in our Singapore facility. Applicants for this position... would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings...

Company: GlobalFoundries
Location: Singapore
Posted Date: 13 Jun 2025

SMTS ULP CMOS Advanced Packaging TSV Integrator

ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team... from an accredited university. Additional professional experience in advanced module development, integration and/or advanced packaging...

Company: GlobalFoundries
Location: Singapore
Posted Date: 13 Jun 2025