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Keywords: Advanced Packaging Integration Engineer, Location: Singapore

Page: 1

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus... in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes...

Company: GlobalFoundries
Location: Singapore
Posted Date: 24 May 2025

Advanced Packaging Process Integration Engineer

Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies.... In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT...

Location: Singapore
Posted Date: 01 May 2025

Senior/Engineer, Advanced Packaging Integration - Chip to Package Integration

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Package Design/ Layout

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Assembly

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF)

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Advanced Packaging Integration Engineer

for layout, design, or integration flow changes Achieve and improve yields impacted by design limitations, working with Probe... years of experience in Process Integration/Development or Package Integration within the semiconductor industry...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Research Engineer(Adv.Packaging & System-lvl Integration of Electronic-Photonic Integrated Circuits)

to Move to Skip to Content Link Search Jobs Job Description Job Title: Research Engineer(Adv.Packaging & System-lvl... (NUS) is looking for applicants for a Research Engineer position. This position supports the development of advanced...

Posted Date: 27 Jun 2025

Lithography Process Engineer - Advanced Packaging

Seeking a senior lithography process engineer to lead unit module development for 300mm advanced packaging. This role... Create alert You agree to our Share this job Lithography Process Engineer - Advanced Packaging Singapore Posted...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

Etch Process Engineer - Advanced Packaging

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV... this job Etch Process Engineer - Advanced Packaging Singapore Posted about 18 hours ago Quick Links Connect We are committed...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes... with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025