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Keywords: Engineer, Advanced Packaging Equipment Engineering, Location: Singapore

Page: 1

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

MTS Advanced Packaging Equipment Engineer

: We are looking for an Equipment Engineer (Principal / MTS level) for advanced packaging project tool installation, maintenance and ownership... / Mechanical / Mechatronics / Microelectronics Engineering At least 8 years of relevant experience in equipment engineering...

Company: GlobalFoundries
Location: Singapore
Posted Date: 03 Jul 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment... and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

MTS Advanced Packaging Lithography Process Engineering

experience with minimum 3 years advanced packaging experience Excellent verbal and written communication skills... is seeking highly skilled and motivated Experienced Lithography Process Engineer to become part of our starting 300mm Advance...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

MTS Advanced Packaging Etch Process Engineering

is seeking highly skilled and motivated Experienced Process Engineer to become part of our starting 300mm Advance Packaging... to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

Lithography Process Engineer - Advanced Packaging

Seeking a senior lithography process engineer to lead unit module development for 300mm advanced packaging. This role... Create alert You agree to our Share this job Lithography Process Engineer - Advanced Packaging Singapore Posted...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

Etch Process Engineer - Advanced Packaging

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV... this job Etch Process Engineer - Advanced Packaging Singapore Posted about 18 hours ago Quick Links Connect We are committed...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus... in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes...

Company: GlobalFoundries
Location: Singapore
Posted Date: 24 May 2025

Advanced Packaging Process Integration Engineer

Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies... new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers...

Location: Singapore
Posted Date: 01 May 2025

Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes..., or other related technical fields 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Metrology

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes..., or other related technical fields 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025