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Keywords: Advanced Packaging Process Integration Engineer, Location: Singapore

Page: 1

Advanced Packaging Process Integration Engineer

Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies.... In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT...

Location: Singapore
Posted Date: 01 May 2025

Senior/Engineer, Advanced Packaging Integration - Program

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Package Design/ Layout

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Assembly

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF)

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Chip to Package Integration

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Package Electrical Failure Analysis/ Physical Failure Analysis

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Engineer, Advanced Packaging Integration Engineering

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 04 Apr 2025

Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

. We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team... or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Advanced Packaging Integration Engineer

initiatives critical to our future! As a Principal Advanced Packaging Integration Engineer, you will work on brand-new solutions... of experience in Process Integration/Development or Package Integration within the semiconductor industry Strong architectural...

Company: Micron
Location: Singapore
Posted Date: 25 Mar 2025

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

. We are looking for an Advanced Packaging Process and Equipment Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 04 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

. We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Dry Etch

. We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team... memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team... and Coordination: Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Metrology

. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team... and Coordination: Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025