Find your dream job now!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Advanced Packaging Process Integration Engineer, Location: Singapore

Page: 1

Advanced Packaging Process Integration Engineer

Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies.... In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT...

Location: Singapore
Posted Date: 01 May 2025

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus... in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes...

Company: GlobalFoundries
Location: Singapore
Posted Date: 24 May 2025

Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF)

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Chip to Package Integration

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Package Design/ Layout

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Integration - Assembly

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields 5 or more years of semiconductor process integration experience, preferably...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Engineer, Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging..., Material, or other related technical fields Experiences in semiconductor process integration will be advantageous...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Advanced Packaging Integration Engineer

years of experience in Process Integration/Development or Package Integration within the semiconductor industry... like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

Lithography Process Engineer - Advanced Packaging

Seeking a senior lithography process engineer to lead unit module development for 300mm advanced packaging. This role... Create alert You agree to our Share this job Lithography Process Engineer - Advanced Packaging Singapore Posted...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

Etch Process Engineer - Advanced Packaging

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV... this job Etch Process Engineer - Advanced Packaging Singapore Posted about 18 hours ago Quick Links Connect We are committed...

Company: Ambition
Location: Singapore
Posted Date: 05 Jul 2025

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

MTS Advanced Packaging Lithography Process Engineering

is seeking highly skilled and motivated Experienced Lithography Process Engineer to become part of our starting 300mm Advance...: To lead Litho module UMD process engineers to develop advance packaging process. Ensure the new process qual lot operation...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

MTS Advanced Packaging Etch Process Engineering

is seeking highly skilled and motivated Experienced Process Engineer to become part of our starting 300mm Advance Packaging... Center, Singapore. The Etch Process Engineer position reports directly to a functional area module manager in Giga Fab...

Company: GlobalFoundries
Location: Singapore
Posted Date: 04 Jul 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality..., reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology...

Company: Micron
Location: Singapore
Posted Date: 02 Jul 2025