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Keywords: Engineer, High Bandwidth Memory(HBM) Package PE, Location: Singapore

Page: 2

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Dicing

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Gang Bond

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Metrology

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Materials

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Molding

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Tape and Reel

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Apr 2025

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Senior/Engineer, Advanced Packaging Die Level Technology - Grinding

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Senior/Engineer, Advanced Packaging Integration - Assembly

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bonding/Debonding

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 25 Apr 2025

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 05 Apr 2025

Engineer, Advanced Packaging Integration Engineering

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 05 Apr 2025

Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025

Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering

component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth...) is responsible to deliver package development for high performance memory products and transfer to manufacturing...

Company: Micron
Location: Singapore
Posted Date: 26 Mar 2025